Intel HOUSEFIRES BTFO'D T F O ' D

>>59190918
Now we wait and see if the 6-core and 4-core will get the same soldering treatment

>>59190947
>being this poor that you can afford the real Ryzen

>>59191110
/g/ is a video game board

They want video game processors

>>59190947
Depends on the size of the DIE.

>Void and micro crack occurrence is mainly affected by the solder area – thus the DIE size. Small DIE size (below 130 mm2) e. g. Skylake will facilitate the void occurence significantly. However, CPUs with a medium to large DIE size (above 270 mm2) e. g. Haswell-E show no significant increase of micro cracking during thermal cycling (Figure 12).

http://overclocking.guide/the-truth-about-cpu-soldering/

>>59191475
Well 8-core Ryzens are pretty much 2 dies so just half of what is in OPs pic, in fact you can see the split between the 2 dies. So it may not be soldered if its below that 130m2 threshold

File: am4-delidded-4.jpg (121KB, 528x960px) Image search: [Google]

121KB, 528x960px

>>59190947
Its the exact same die and package. All Ryzen chips are soldered.

>>59191545
Don't spread misinformation, kid.
What you see in the picture there is a singular die. There are two solder pads on top of it, you're not seeing a gap between two separate dies.
Pic related is a Bristol Ridge APU. Note again the two solder pads atop a singular monolithic die.

Next time you think about posting, don't.