Indications are that Kaby Lake doesn't have a noticable

File: 1384124417282.jpg (107KB, 1440x900px) Image search: [Google]

107KB, 1440x900px

Noone? Is everyone all about AMD today?
Makes sense.
I hope Zen will be good stuff.

>>57985548
Graphene CPUs when?

>>57985548
yes, and the 'review' chips seem to use fanboy jizz as they are higher temp, higher power, and effectively the same or worse then skylake, fun thing is some benches kaby loses up to 1% over skylake

the only good aspect of it is the decoder which they beefed the fuck up, and thats about it.

>>57985548
>Indications are that Kaby Lake doesn't have a noticable increase in IPC compared to Skylake.
Intel has stated this would be the case almost a year ago. They are not improving performance, in fact they expect performance to worsen to increase power efficiency.

https://thestack.com/iot/2016/02/05/intel-william-holt-moores-law-slower-energy-efficient-chips/

Yes, of course they will use the shitty TIM under the heatspreader. It has not caused any defects, people are still buying CPUs and they are saving money. Why do you think they would reverse this?

>>57985548
yeah they still use shitty tim to bridge the core and the heat spreader together. if you want to avoid that go x99 with either haswell-e or broadwell-e. they still use solder to bridge.

>>57988076
well they actually have a semi valid reason. die size. the smaller you go, the more stress there is on the die when fusing the heat spreader together with the core with tim. the little dies have less surface area and cannot handle that much tension when the solder cools and shrinks.

2011 chips still use solder not necessary because they are server class chips, but because they have larger dies. more surface area means they can handle more tension stress when the heat spreader is fused with solder.

it really doesn't cost intel that much to use solder over tim, but yields reduction cost millions. intel is willing to sacrifice thermal performance for increased yields.

not saying intel couldn't do it if they really wanted to. they still could but have reduced yields from increased manufacturing damage. that's why sandy was the last generation to use soldered heat spreaders. their dies where large enough still to easily handle the stress and maintain high yields.