Why don`t they make a CPU with a integrated heat sink? No more

>>55752321
Because stock coolers are shit, and thermal paste isn't a hassle.

>>55752549
>stock coolers are shit

They just werk. Integrated heat sinks would mean a complete redesign anyway.

>thermal paste isn't a hassle.

Yes it is

>>55752619
You're dumb

File: liquidcoolin.jpg (114KB, 1500x1001px) Image search: [Google]

114KB, 1500x1001px

Because we integrated watercooling now

>>55752623

NO U

>>55752629

Does the piping go through the other side?

>>55752619
They don't work well though. Integrated heatsinks make no sense considering current mb design and would be inefficient for overclocking.

Thermal paste is as easy as putting toothpaste on a brush, don't be a moron.

File: cmosaic-cross-section-1024x732.png (490KB, 1024x732px) Image search: [Google]

490KB, 1024x732px

>>55752654
Yes, obviously.

File: cmosaic-diagram.jpg (87KB, 548x283px) Image search: [Google]

87KB, 548x283px

>>55752720

Why even allow for anything to be swapped in and out at will?

It just opens up the system to problems the manufacturer didn't predict.

Obviously all computers should be non-serviceable pre-mades

File: 1462566011816.jpg (53KB, 850x550px) Image search: [Google]

53KB, 850x550px

>>55752321
anon if thermal paste is that much of a challenge to you, maybe you should just buy an Xbox and an iPad and leave us alone

>>55752321
>No more hassles with thermal paste that way.
How the fuck is it hassle? You pretty much can't fuck this up in case you managed to put some amount of it on about the right spot.

>>55752760

Anything can be swapped out if you know how to solder.

>>55752791

20 jars of Hellmann's have been sent to your address.

To be fair most laptops and non-cpu-upgradeable pcs (like most macs) do have an integrated cooler, I know it was installed in the factory in the same way we install our own ones but in the end it's still a bespoke cooler for that specific case, configuration and targeted thermal load. There's possible gains to be made by making the integrated heat spreader on the cpu directly attached to the cooler but that removes a lot of repairability which increases RMA costs for manufacturers. In the end it's easier to just use a thermal paste contact point and up-spec the cooling design a few watts.

File: pentium-2-slot-load.jpg (201KB, 1000x959px) Image search: [Google]

201KB, 1000x959px

>>55752321
They used to.

>>55752870
Thanks rebbit

>>55752321

Form factor, CPUs go into thousands of different cases, some large some small. Not all cases would fit a standard heat sync.

PC manufacturers would hate that.

>>55752321
I wish I had photoshop at the ready just to point out how stupid this concept is.

File: Nk8ulSK.gif (2MB, 280x225px) Image search: [Google]

2MB, 280x225px

>thermal paste
>hassle

Buncha lazy neckbeards up in here.

>>55752321

>OH_SHIT_THE_FAN_DIED.jpg

>>55753006
YES thank you for posting pentium2, anon!
God, look at that sexy design. Why did intel move away from this architecture? Fuck ZIF, LGA, etc. This was the way.

>>55754067
I guess you hate performance.

Those chips would never reach the clock speeds of modern chips even with modern manufacturing techniques. You need way more pins and heatsinks than those can support.

>>55754186
*bigger heatsinks

>>55752321

A combination of costs and the fact that if a heatsink's attached directly to a CPU, there's a chance that sudden movements would tear it apart. Vapor chamber IHSs are the future tho.

>>55753006
No, they didn't. Even in SECC1/2 the heatsink was separate.

>>55754067
And fuck you too. SECC was NOT the way. It was a stop gap between moving the L2 cache off the motherboard, and moving it on-die, without being fuck-expensive (PPRO200/1M, for example)

File: fans.jpg (236KB, 1280x720px) Image search: [Google]

236KB, 1280x720px

you guys dont know shit about cooling

>>55756241
Do you really need all that for Raspberry Pi though?

>>55756241

Now were cooling

>>55752321
I would really like to see a vapor chamber instead of a heat spreader on contact with the die.